Early challenges in Mini-LED Backlight adoption—such as uneven high-density micro-LED illumination, electromagnetic interference (EMI), and concentrated thermal load from dense lamp arrays—have been overcome by specialized PCB assembly technologies, particularly metal-core PCBs (MCPCB), rigid-flex PCBs, and high-precision surface mount technology (SMT). These innovations effectively enhance the stability of LED drive circuits for precise zone dimming, while integrating EMI shielding layers to eliminate interference from external TV/display components (such as mainboards, power supplies, and control modules) and surrounding electronic devices. MCPCBs and rigid-flex PCBs, in particular, balance ultra-slim form factors with reliable signal transmission and efficient heat dissipation, supporting the high-density micro-LED layout and slim display design of Mini-LED backlights without compromising backlight performance. This technological leap has enabled Mini-LED Backlight PCB Assemblies to outperform traditional LED backlight circuits in key areas: